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Semiconductor Back-Grinding The silicon wafer on which the active elements are created is a thin circular disc, typically 150mm or 200mm in diameter.

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International Journal of Machine Tools & Manufacture 41 (2001) 659–672 Fine grinding of silicon wafers Z.J. Pei a,*, Alan Strasbaugh b a Department of Industrial ...

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Resin diamond grinding wheels are applied to the back thinning grinding (back grinding) of IC silicon wafers. The wheels should have very high performance

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